Xef2蝕刻機二氟化氙

xef2 etcher is a system for isotropic silicon etching by xef2 vapour.
it offers a cost-effective solution for removal of silicon as a sacrificial layer and its removal by xef2 is the best-released process ever used for mems devices.
besides the silicon layer, xef2 etcher also etches ta, w, mo and other materials, which can be etched by sf6 plasma. we can custom made your system according to your requirement.
key features
the etching is very gentle process, with no plasma involved.
etching of silicon is gas (vapor) process, and there is no liquid involved and therefore the notoriously known sticking problem is completely eliminated.
the implementation of a xef2 process brings another advantage over the conventional mems release processes. it can be done at chip level even after packaging. the consequence is truly incredible.